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Selected: I

I-shaped phase change memory cell

Semiconductor device manufacturing: process – Having selenium or tellurium elemental semiconductor component
Reexamination Certificate

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I. C. thin film processing and protection method

Semiconductor device manufacturing: process – Making passive device – Resistor
Patent

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I.C. thin film resistor stabilization method

Semiconductor device manufacturing: process – Making passive device – Resistor
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I/O driver design for simultaneous switching noise minimization

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Patent

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I/O ESD protection device for high performance circuits

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate

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IC card and booking-account system using the IC card

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
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IC card indicating state of usage and system therefor

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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IC chip manufacturing method

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
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IC chip mounting method

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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IC chip solder bump structure and method of manufacturing same

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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IC devices having TSVS including protruding tips having IMC...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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IC die analysis via back side circuit construction with heat...

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
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IC die power connection using canted coil spring

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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IC interconnect formation with chemical-mechanical polishing and

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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IC interconnect structures and methods for making same

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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IC mechanical planarization process incorporating two slurry com

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Patent

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IC mechanical planarization process incorporating two slurry com

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Patent

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IC package having a conductive material at least partially...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
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IC package with dual heat spreaders

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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IC resistor and capacitor fabrication method

Semiconductor device manufacturing: process – Making passive device
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