Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-03-08
2005-03-08
Wilson, Allan R. (Department: 2815)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257S774000, C257S775000, C257S776000, 73, 73, 73
Reexamination Certificate
active
06864171
ABSTRACT:
Thermo-mechanical stress on vias is reduced, thereby reducing related failures. This can be done by maintaining a via-to-metal area ratio at least as large as a predetermined value below which the additional stress on the vias does not significantly increase.
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Cowley Andy
Fayaz Mohammed Fazil
Hierlemann Matthias P.
Hoinkis Mark D.
Kaltalioglu Erdum
Brinks Hofer Gilson & Lione
Ortiz Edgardo
Wilson Allan R.
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