Via interconnect forming process and electronic component...

Details Via interconnect forming process and electronic component... Via interconnect forming process and electronic component...

2005-01-04

2005-01-04

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S640000

Reexamination Certificate

active

06838372

ABSTRACT:
A process for masking an electronic component substrate involving application of a temporary mask material to the substrate to form a removably adhered temporary mask over the surface. Exemplary mask materials include polymer films and aqueous hardenable liquid coatings. An electronic component substrate having a temporary mask for masking the substrate surface from interconnect fill material.

REFERENCES:
patent: 5250388 (1993-10-01), Schoch et al.
patent: 5523185 (1996-06-01), Goto
patent: 5637176 (1997-06-01), Gilleo et al.
patent: 6011629 (2000-01-01), Ootake et al.
patent: 6057224 (2000-05-01), Bothra et al.
patent: 6063476 (2000-05-01), Kinoshita
patent: 6133635 (2000-10-01), Bothra et al.
patent: 6221779 (2001-04-01), Dennison et al.
patent: 6228678 (2001-05-01), Gilleo et al.
patent: 6228681 (2001-05-01), Gilleo et al.
patent: 6245662 (2001-06-01), Naik et al.
patent: 6465084 (2002-10-01), Curcio et al.
patent: 6465358 (2002-10-01), Nashner et al.
patent: 6503827 (2003-01-01), Bombardier et al.
patent: 6555467 (2003-04-01), Hsu et al.
patent: 6605534 (2003-08-01), Chung et al.
patent: 6645607 (2003-11-01), Curcio et al.
patent: 6664023 (2003-12-01), MacDowell et al.
patent: 20030134505 (2003-07-01), Dalton et al.
Khol et al.; “Air-Gaps for Electrical Interconnects”; pp. 49-51; Electrochemical and Solid-State Letters, 1(1) 49-51 (1998); May 27, 1998.

Affiliated with

Also associated with

Rating

Via interconnect forming process and electronic component... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Via interconnect forming process and electronic component..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Via interconnect forming process and electronic component... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3421523