Sensor element with trenched cavity
Sensor with at least one micromechanical structure, and...
SI wafer-cap wafer bonding method using local laser energy,...
Side port package for micromachined fluid sensor
Side-bonding method of flip-chip semiconductor device, MEMS...
Silicon device manufacturing method, silicon device, and...
Silicon pressure sensor and the manufacturing method thereof
Silicon undercut prevention in sacrificial oxide release...
Silicon-based RF system and method of manufacturing the same
Single crystal, dual wafer, tunneling sensor or switch with...
Single proof mass, 3 axis MEMS transducer
Stack type surface acoustic wave package, and method for...
Stacked via-stud with improved reliability in copper metallurgy
Stress-controlled dielectric integrated circuit
Substrate and method for producing the same, and thin film...
Substrate preparation method for a MEMS fabrication process
Substrate with multiple encapsulated pressures
Surface micro-machined sensor with pedestal
Surface micromachining process
Surface micromachining process for manufacturing...