Surface micromachining process for manufacturing...

Details Surface micromachining process for manufacturing... Surface micromachining process for manufacturing...

2006-07-11

2006-07-11

Kebede, Brook (Department: 2823)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S053000

Reexamination Certificate

active

07074634

ABSTRACT:
A surface micromachining process for manufacturing Electro-acoustic transducers, particularly ultrasonic transducers, the transducers comprising a silicon semiconductor substrate (1), on an upper surface of which one or more membranes (18) of resilient materials are supported by a structural layer (11) of insulating material, rigidly connected to the semiconductor substrate (1), the resilient material having a Young's modulus not lower than 50 GPa, the membranes (18) being metallised, the transducers including one or more lower electrodes (23, 25), rigidly connected to the semiconductor substrate. The process is characterised in that the structural layer (11) includes silicon monoxide. The invention further relates to an Electro-acoustic transducer, particularly an ultrasonic transducer, characterised in that the insulating material of the structural layer (11) is silicon monoxide. The invention also relates to an intermediate product for utilisation in the process for realising Electro-acoustic transducers, particularly ultrasonic transducers.

REFERENCES:
patent: 5025346 (1991-06-01), Tang et al.
patent: 5366587 (1994-11-01), Ueda et al.
patent: 5573679 (1996-11-01), Mitchell et al.
patent: 6096656 (2000-08-01), Matzke et al.

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