Side port package for micromachined fluid sensor

Details Side port package for micromachined fluid sensor Side port package for micromachined fluid sensor

1995-06-06

1997-04-01

Picardat, Kevin

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

29840, 438125, H01L 2160

Patent

active

056165218

ABSTRACT:
An integrated circuit-type DIP package for micromachined (silicon) sensors such as pressure sensors has the fluid ports necessary for operation of the pressure sensor located laterally (rather than extending vertically) from the upper and lower portions of the assembled package. This lateral arrangement includes a first nozzle extending laterally from the upper surface of the package cover (lid) and a side port communicating with a second nozzle located in the lateral surface of the package body. This provides a low profile package by eliminating the otherwise vertical nozzles and also allows mounting of such a package on a printed circuit board without the need to drill a hole to accommodate the nozzle extending from the bottom of the package. The side ports also enhance the ability to mount the package and temporarily plug the side ports during cleaning of the printed circuit board, since the side ports are easily accessible rather than being hidden underneath the package when mounted. This package is suitable for absolute, differential and gage types of pressure sensors as well as other types of sensors where it is necessary for fluid to enter the sensor housing. The lateral ports also reduce stress on the sensor due to less bending of the fluid tubes attaching to the package nozzles, hence eliminating certain types of package-induced failure.

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