Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2009-08-24
2010-10-26
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C438S108000, C438S113000, C438S462000, C257SE21599, C257SE21511
Reexamination Certificate
active
07820468
ABSTRACT:
Disclosed herein is a stack type surface acoustic wave package. The surface acoustic wave package comprises a first bare chip having a plurality of electrodes formed thereon, a second bare chip having a plurality of electrodes and via-holes formed thereon, a connecting portion electrically connecting the first bare chip to an upper surface of the second bare chip such that the electrodes of the first bare chip face the electrodes of the second bare chip, and a sealing member provided on the first and second bare chips to form an air-tight space on an operating surface between the first and second bare chips. The surface acoustic wave package can prevent deformation due to thermal impact from the outside during a packaging process, enhancing reliability of the product, minimizing the size of the product, and reducing manufacturing costs by reducing the number of components and material costs.
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Korean Intellectual Property Office, Office Action, mailed Aug. 25, 2006.
USPTO OA mailed Sep. 8, 2009.
Kim Nam Hyeong
Lee Seung Hee
Lee Young Jin
Park Doo Cheol
Park Joo Hun
Fourson George
Lowe Hauptman & Ham & Berner, LLP
Samsung Electro-Mechanics Co. Ltd.
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