Surface micromachining process

Details Surface micromachining process Surface micromachining process

1994-12-01

1997-09-02

Chea, Thorl

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

29 2541, 438619, 438666, H01G 700, B44C 122

Patent

active

056627718

ABSTRACT:
A method for making micromachined structures that includes pinpoint polysilicon bumps for eliminating the stiction problem associated with elements of the micromachined structure, such as movable or fixed beams. The pinpoint polysilicon bumps provide a reduced contact area for the beam which reduces the chances that there will be a stiction problem due to static or surface charge. The method takes advantage of an edge alignment technique to achieve a geometry for pinpoint bump structures of as low as 0.20 .mu.m. The bump structures are located in a region of the movable and fixed beams at the edge adjacent the gaps between the interleaved fingers. The method forms bump structures that have a circular design. The formation of the bump structures is carefully controlled with respect to the overlap of these bump structures into interdigitated structures.

REFERENCES:
patent: 5025346 (1991-06-01), Taug et al.
patent: 5189777 (1993-03-01), Guckel et al.
patent: 5337606 (1994-08-01), Bennett et al.

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