Copper-metallized integrated circuits having electroless...
Copper/low dielectric interconnect formation with reduced electr
Corrosion resistance for copper interconnects
Corrosion resistant imager
Corrosion sensitivity structures for vias and contact holes in i
CoSi.sub.2 salicide method
CoSix process to improve junction leakage
Crack stop formation for high-productivity processes
Crackstop and oxygen barrier for low-K dielectric integrated...
Creating air gap in multi-level metal interconnects using...
Creation of subresolution features via flow characteristics
Cross diffusion barrier layer in polysilicon
Cross reference to related application
Cross-contamination control for processing of circuits...
Cross-contamination control for semiconductor process flows...
Cross-fill pattern for metal fill levels, power supply...
Crystal thinning method for improved yield and reliability
Crystalline aluminum oxide layers having increased energy...
Crystallographic modification of hard mask properties
Cu capping layer deposition with improved integrated circuit...