Alternative interconnect structure for semiconductor devices

Alternative interconnect structure for semiconductor devices

Alternative methods for fabrication of substrates and...

Aluminum and copper bimetallic bond pad scheme for copper...

Aluminum based conductor for via fill and interconnect

Aluminum cap for reducing scratch and wire-bond bridging of...

Aluminum contact integration on cobalt silicide junction

Aluminum hardmask for dielectric etch

Aluminum metal line of a semiconductor device and method of...

Aluminum metallization by a barrier metal process

Aluminum nitride thin film formation on integrated circuits

Aluminum oxide as liner or cover layer to spacers in memory...

Aluminum plug process

Aluminum spiking inspection method

Aluminum-based metallization exhibiting reduced...

Aluminum-copper bond pad design and method of fabrication

Aluminum-filled via structure with barrier layer

Aluminum-palladium alloy for initiation of electroless plating

Aluminum/copper clad interconnect layer for VLSI applications

Amine-free deposition of metal-nitride films