Aluminum-palladium alloy for initiation of electroless plating

Details Aluminum-palladium alloy for initiation of electroless plating Aluminum-palladium alloy for initiation of electroless plating

1996-08-29

1999-05-25

Zimmerman, John J.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438686, 438653, 427123, 428650, B32B 1504, H01L 2128

Patent

active

059077905

ABSTRACT:
Thin layers of aluminum and palladium are deposited and annealed to produce aluminum-palladium alloy. The surface of the alloy is exposed and treated with an aluminum enchant to produce a catalytic surface. The catalytic surface is used for electroless plating of nickel, providing excellent plating uniformity and adhesion, as well as a reduced plating induction time. Several variants of the basic method are shown.

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