Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-03-27
2007-03-27
Estrada, Michelle (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S261000, C257SE21180, C257SE21280, C257SE29201, C257SE21210, C257SE21423, C257SE21679
Reexamination Certificate
active
11087793
ABSTRACT:
For fabricating a memory device, spacers are formed to sides of word-line gates. In addition, aluminum oxide is formed as one of a liner layer or a cover layer to the spacers. The aluminum oxide has a chemical composition of Al2O3for example. Such aluminum oxide may be used as an etch stop layer in a periphery region, a metal silicide block, and a hydrogen block for enhanced performance of the memory device.
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Jeon Joong
Park Jae-yong
Shiraiwa Hidehiko
Torii Satoshi
Choi Monica H.
Spansion LLC
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