Aluminum oxide as liner or cover layer to spacers in memory...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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Details

C438S261000, C257SE21180, C257SE21280, C257SE29201, C257SE21210, C257SE21423, C257SE21679

Reexamination Certificate

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11087793

ABSTRACT:
For fabricating a memory device, spacers are formed to sides of word-line gates. In addition, aluminum oxide is formed as one of a liner layer or a cover layer to the spacers. The aluminum oxide has a chemical composition of Al2O3for example. Such aluminum oxide may be used as an etch stop layer in a periphery region, a metal silicide block, and a hydrogen block for enhanced performance of the memory device.

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patent: 5731242 (1998-03-01), Parat et al.
patent: 5946589 (1999-08-01), Ng et al.
patent: 2003/0015752 (2003-01-01), Palm et al.
patent: 2005/0153511 (2005-07-01), Jung
patent: 2006/0192243 (2006-08-01), Bhattacharyya

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