‘Via first’ dual damascene process for copper...
3-D semiconductor die structure with containing feature and...
3D reservoir to improve electromigration resistance of...
3D silicon-silicon die stack structure and method for fine...
Acceleration of etch selectivity for self-aligned contact
Activation of oxides for electroless plating
Activation of oxides for electroless plating
Activation plate for electroless and immersion plating of...
Active area bonding compatible high current structures
Add one process step to control the SI distribution of Alsicu to
Adherent all-gold electrode structure for lithium niobate...
Adhesion and minimizing oxidation on electroless CO alloy...
Adhesion enhancement between CVD dielectric and spin-on...
Adhesion improvement for low k dielectrics to conductive...
Adhesion of copper and etch stop layer for copper alloy
Adhesion of tungsten nitride films to a silicon surface
Adhesion promotion method for CVD copper metallization in IC...
Adhesion promotion method for CVD copper metallization in IC...
Adhesion promotion method for electro-chemical copper...
Adjusting the size of conductive lines based upon contact size