Search
Selected: W

Wafer level package and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wafer level package and method of fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wafer level package and multi-package stack

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wafer level package and the process of the same

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wafer level package configured to compensate size difference...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wafer level package for micro device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wafer level package for surface acoustic wave device and...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Temperature
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wafer level package having a stress relief spacer and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wafer level package having redistribution interconnection...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wafer level package including a device wafer integrated with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wafer level package including ground metal layer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wafer level package incorporating dual compliant layers and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wafer level package incorporating dual stress buffer layers...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wafer level package integrated circuit incorporating solder...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wafer level package structure and production method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wafer level package structure of optical-electronic device...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wafer level package structure of optical-electronic device...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wafer level package structure with a heat slug

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wafer level package structure, and sensor device obtained...

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wafer level package with air pads and manufacturing method...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0
  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.