Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2008-06-05
2011-10-11
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S737000, C257SE23021, C257SE23069
Reexamination Certificate
active
08035226
ABSTRACT:
An integrated circuit including solder balls containing an elastic or resilient material core, a hard or rigid shell substantially enclosing the core, and an electrical contact layer substantially enclosing the shell. The elastic or resilient core serves as a stress buffer layer in a wafer level package (WLP) integrated circuit. The elastic or resilient material core may include an organic plastic material, such as a Divinilbenzene cross-linked co-polymer of relatively high resistance. This material has a relatively good elongation property so that it can effectively absorb forces exerted upon the integrated circuit by, for example, the flexing of a printed circuit board (PCB) or other structure to which the integrated circuit is attached. The hard or rigid shell serves to contain the elastic or resilient core and may include copper. The electrical contact layer serve to provide a good adhesive electrical contact to an under bump metallization (UBM) layer, may include a lead free, Tin-Gold (SnAg) material.
REFERENCES:
patent: 6362087 (2002-03-01), Wang et al.
patent: 7338891 (2008-03-01), Jeong
patent: 2006/0226545 (2006-10-01), Suminoe et al.
Bojkov Christo P.
Cate Steve Detlev
Ghai Ajay Kumar
Wilcoxen Duane T.
Advent IP, P.C., L.L.C.
Clark Jasmine
Maxim Integrated Products Inc.
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