LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

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Wafer level chip size package having redistribution layers

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level chip size package having rerouting layers

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level chip size packaged chip device with a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level chip size packaged chip device with an N-shape...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level chip size packaged chip device with an N-shape...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level chip-scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level CSP packaging concept

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding

Reexamination Certificate

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Wafer level device package with sealing line having...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level electro-optical semiconductor manufacture...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level hermetic bond using metal alloy with raised feature

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level hermetically sealed MEMS device

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level incapsulation chip and encapsulation chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level integration package

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding – With means to shield device contained in housing or package...

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level LED package structure and method for making the...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level MEMS packaging

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level package

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level package and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Reexamination Certificate

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Wafer level package and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Wafer level package and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

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