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Selected: Q

Q inductor with multiple metallization levels

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Patent

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QFN housing having optimized connecting surface geometry

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate

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QFN semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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QFN semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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QFN semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Quad flat flip chip package and leadframe thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Quad flat no lead (QFN) grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...
Reexamination Certificate

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Quad flat no-lead (QFN) grid array package, method of making...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...
Reexamination Certificate

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Quad flat no-lead chip carrier

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Quad flat no-lead package structure and manufacturing method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Quad flat non-lead package of semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Quad flat non-leaded chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Quad flat non-leaded package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Quad flat non-leaded package and leadframe for use in a quad...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Quad flat non-leaded package comprising a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Quad flat non-leaded package structure for housing CMOS sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Quad flat non-leaded semiconductor package and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Quad flat package heat slug composition

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent

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Quad memory cell and method of making same

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Quadrilateral multichip computer systems and printed circuit boa

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...
Patent

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