LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Bulk effect device – Bulk effect switching in amorphous material

I-shaped phase change memory cell

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Non-single crystal – or recrystallized – active junction...

I-shaped phase change memory cell with thermal isolation

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

I/C chip suitable for wire bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

I/O and power ESD protection circuits by enhancing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

I/O architecture for integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

I/O card device and method for making the same

Active solid-state devices (e.g. – transistors – solid-state diode – Regenerative type switching device – Device protection

I/O cell and ESD protection circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

I/O circuit that utilizes a pair of well structures as...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

I/O ESD protection device for high performance circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

I/O pad structures for integrated circuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

I/O pin having solder dam for connecting substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

IC bonding pad combined with mark or monitor

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

IC card

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

IC card

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

IC card

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

IC card

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

IC card and manufacturing method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

IC card and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

IC card and method of manufacturing the same