Wafer level package structure and production method therefor

Details Wafer level package structure and production method therefor Wafer level package structure and production method therefor

2006-11-24

2011-12-20

Arora, Ajay K (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257SE23193, C438S125000

Reexamination Certificate

active

08080869

ABSTRACT:
A wafer level package structure, in which a plurality of compact sensor devices with small variations in sensor characteristics are formed, and a method of producing the same are provided. This package structure has a semiconductor wafer having plural sensor units, and a package wafer bonded to the semiconductor wafer. The semiconductor wafer has a first metal layer formed with respect to each of the sensor units. The package wafer has a bonding metal layer at a position facing the first metal layer. Since a bonding portion between the semiconductor wafer and the package wafer is formed at room temperature by a direct bonding between activated surfaces of the first metal layer and the bonding metal layer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding portion.

REFERENCES:
patent: 4988035 (1991-01-01), Ueno et al.
patent: 5392650 (1995-02-01), O'Brien et al.
patent: 5448014 (1995-09-01), Kong et al.
patent: 5525549 (1996-06-01), Fukada et al.
patent: 5654244 (1997-08-01), Sakai et al.
patent: 5869876 (1999-02-01), Ishio et al.
patent: 5948982 (1999-09-01), Woodruff et al.
patent: 6222868 (2001-04-01), Ouchi et al.
patent: 6228675 (2001-05-01), Ruby et al.
patent: 6257060 (2001-07-01), Leonardson et al.
patent: 6465892 (2002-10-01), Suga
patent: 6555901 (2003-04-01), Yoshihara et al.
patent: 6596117 (2003-07-01), Hays et al.
patent: 6683358 (2004-01-01), Ishida et al.
patent: 6873054 (2005-03-01), Miyazawa et al.
patent: 6892578 (2005-05-01), Saitoh et al.
patent: 7176599 (2007-02-01), Kawachi et al.
patent: 7406870 (2008-08-01), Seto
patent: 2002/0008444 (2002-01-01), Sakata et al.
patent: 2002/0180031 (2002-12-01), Yamaguchi et al.
patent: 2003/0003684 (2003-01-01), Farrens et al.
patent: 2003/0038328 (2003-02-01), Ishio
patent: 2003/0183921 (2003-10-01), Komobuchi et al.
patent: 2004/0016981 (2004-01-01), Yoshida et al.
patent: 2004/0053435 (2004-03-01), Ikushima et al.
patent: 2004/0065638 (2004-04-01), Gogoi
patent: 2004/0207485 (2004-10-01), Kawachi et al.
patent: 2004/0238943 (2004-12-01), Fujii
patent: 2005/0167795 (2005-08-01), Higashi
patent: 2005/0217373 (2005-10-01), Ishikawa et al.
patent: 2006/0022325 (2006-02-01), Hwang et al.
patent: 2007/0158822 (2007-07-01), Fujii
patent: 2008/0302185 (2008-12-01), Yakabe et al.
patent: 103 51 761 (2004-05-01), None
patent: 0 278 030 (1988-08-01), None
patent: 0 905 838 (1999-03-01), None
patent: 60-053054 (1985-03-01), None
patent: 02-012663 (1990-01-01), None
patent: 02-063173 (1990-03-01), None
patent: 02-079044 (1990-06-01), None
patent: 2-218172 (1990-08-01), None
patent: 3-67177 (1991-03-01), None
patent: 05-095122 (1993-04-01), None
patent: 05-175247 (1993-07-01), None
patent: 5-281251 (1993-10-01), None
patent: 5-288771 (1993-11-01), None
patent: 6-45618 (1994-02-01), None
patent: 06-318625 (1994-11-01), None
patent: 07-283334 (1995-10-01), None
patent: 08-015300 (1996-01-01), None
patent: 8-18068 (1996-01-01), None
patent: 08-032090 (1996-02-01), None
patent: 9-203747 (1997-08-01), None
patent: 09-266266 (1997-10-01), None
patent: 9-292049 (1997-11-01), None
patent: 10-177034 (1998-06-01), None
patent: 2791429 (1998-06-01), None
patent: 2001-060635 (2001-03-01), None
patent: 2001-068616 (2001-03-01), None
patent: 2001-183389 (2001-07-01), None
patent: 2003-69044 (2003-03-01), None
patent: 2003-100919 (2003-04-01), None
patent: 2003-179085 (2003-06-01), None
patent: 2003-318178 (2003-11-01), None
patent: 2003-329704 (2003-11-01), None
patent: 2004-028912 (2004-01-01), None
patent: 2004-057507 (2004-02-01), None
patent: 2004-085547 (2004-03-01), None
patent: 3532788 (2004-03-01), None
patent: 2004-109114 (2004-04-01), None
patent: 2004-200547 (2004-07-01), None
patent: 2004-209585 (2004-07-01), None
patent: 2004-233072 (2004-08-01), None
patent: 2004-304622 (2004-10-01), None
patent: 2004-364041 (2004-12-01), None
patent: 2005-091166 (2005-04-01), None
patent: 2005-127750 (2005-05-01), None
patent: 2005-129888 (2005-05-01), None
patent: 2005-166909 (2005-06-01), None
patent: 2005-181644 (2005-07-01), None
patent: 2005-191556 (2005-07-01), None
patent: 2005-251898 (2005-09-01), None
patent: 2005-292117 (2005-10-01), None
patent: 2006-202974 (2006-08-01), None
patent: 2006322717 (2006-11-01), None
patent: 1998-86900 (1998-12-01), None
patent: 2003-17428 (2003-03-01), None
patent: 093107297 (2006-02-01), None
patent: WO-2005/086597 (2005-09-01), None
patent: WO-2005/104228 (2005-11-01), None
patent: WO-2006/030716 (2006-03-01), None
Notice of Official Action for the Application No. 095143570 from Taiwan Intellectual Property Office dated Dec. 14, 2009.
Notification of Reasons for Refusal for the Application No. 2006-089556 from Japan Patent Office mailed Dec. 5, 2006.
International Search Report for the Application No. PCT/JP2006/323445 mailed Feb. 6, 2007.
Decision of Refusal for the Application No. 2006-089558 from Japan Patent Office mailed Sep. 25, 2007.
Decision of Refusal for the Application No. 2006-089589 from Japan Patent Office mailed Sep. 25, 2007.
Decision of Refusal for the Application No. 2006-089633 from Japan Patent Office mailed Sep. 25, 2007.
Notification of Reasons for Refusal for the Application No. 2005-371042 from Japan Patent Office mailed Dec. 26, 2006.
Notification of Reasons for Refusal for the Application No. 2006-089590 from Japan Patent Office mailed Dec. 26, 2006.
Notification of Reasons for Refusal for the Application No. 2006-089634 from Japan Patent Office mailed Dec. 26, 2006.
Notification of Reasons for Refusal for the Application No. 2006-089558 from Japan Patent Office mailed Mar. 6, 2007.
Notification of Reasons for Refusal for the Application No. 2006-089588 from Japan Patent Office mailed Mar. 6, 2007.
Notification of Reasons for Refusal for the Application No. 2006-089633 from Japan Patent Office mailed Mar. 6, 2007.
Takagi, Hideki et al., “Low Temperature, Pressure Less Bonding of Si and SiO2by the Surface Activation Method”, Japan Welding Society Paper, 1997, vol. 61, pp. 224-225.
Itoh, Toshihiro et al., “Problems in MEMS Packaging and Application of Surface Activated Bonding (SAB) Method”, Electronics Mounting Society Paper, 2001, vol. 4, No. 1, pp. 25-27.
Esashi, Masayoshi, “MEMS and Its Application”, Journal of Japan Institute of Electronics Packaging, 2002, vol. 5, No. 6, pp. 537-541.
Suga, Tadatomo, “Bonding Technology for Micro-Machines”, Plastic Processing Symposium, 2002, 211th, pp. 15-20.
Akaike, Hirotake et al., “Technology Tendency of Bonding for MEMS Device by Japanese Patent Research”, Japan Institute of Electronics Packaging, 2003, vol. 6, No. 7, pp. 602-609.
Korean Office Action for the Application No. 10-2008-7012313 from Korean Intellectual Property Office dated Nov. 30, 2010.
International Search Report for the Application No. PCT/JP2006/323459 mailed Feb. 6, 2007.
Taiwanese Office Action for the Application No. 095143554 from Taiwanese Patent Office dated Sep. 17, 2009.
U.S. Restriction Requirement for the U.S. Appl. No. 12/094,772 from U.S. Patent and Trademark Office mailed Jun. 8, 2010.
U.S. Non-Final Office Action for the Application No, 12,094,674 from U.S.Patent and Trademark Office mailed Oct. 1, 2010.
U.S. Final Office Action for the U.S. Appl. No. 12/094,674 from U.S. Patent and Trademark Office mailed Mar. 16, 2011.
Notification of Reasons for Refusal for the Application No. 2006-089555 from Japan Patent Office mailed Dec. 5. 2006.
Notification of Reasons for Refusal for the Application No. 2006-089579 from Japan Patent Office mailed Dec. 5, 2006.
Notification of Reasons for Refusal for the Application No. 2006-089580 from Japan Patent Office mailed Dec. 5, 2006.
Notification of Reasons for Refusal for the Application No. 2006-089586 from Japan Patent Office mailed Dec. 26, 2006.
Supplementary European Search Report for the Application No. 06 83 3259 dated Jun. 24, 2011.

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