Wafer level package including a device wafer integrated with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S777000, C257SE23011

Reexamination Certificate

active

07576426

ABSTRACT:
According to an exemplary embodiment, a wafer level package includes a device wafer including at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The wafer level package includes a first polymer layer situated over the device wafer. The wafer level package includes at least one passive component situated over the first polymer layer and having a first terminal and a second terminal. The first terminal of the at least one passive component is electrically connected to the at least one device wafer contact pad. The wafer level package includes a second polymer layer situated over the at least one passive component. The wafer level package includes at least one polymer layer contact pad situated over the second polymer layer and electrically connected to the second terminal of the at least one passive component.

REFERENCES:
patent: 5323051 (1994-06-01), Adams et al.
patent: 5448014 (1995-09-01), Kong et al.
patent: 5757072 (1998-05-01), Gorowitz et al.
patent: 6057597 (2000-05-01), Farnworth et al.
patent: 6214644 (2001-04-01), Glenn
patent: 6297072 (2001-10-01), Tilmans et al.
patent: 6376280 (2002-04-01), Ruby et al.
patent: 6380616 (2002-04-01), Tutsch et al.
patent: 6399426 (2002-06-01), Capote et al.
patent: 6402970 (2002-06-01), Lin
patent: 6498114 (2002-12-01), Amundson
patent: 6530515 (2003-03-01), Glenn et al.
patent: 6566745 (2003-05-01), Beyne et al.
patent: 6630725 (2003-10-01), Kuo et al.
patent: 6743656 (2004-06-01), Orcutt et al.
patent: 6743991 (2004-06-01), Wong et al.
patent: 6767764 (2004-07-01), Saia et al.
patent: 6777263 (2004-08-01), Gan et al.
patent: 6787897 (2004-09-01), Geefay et al.
patent: 6794739 (2004-09-01), Kobayashi et al.
patent: 6800508 (2004-10-01), Kimura
patent: 6838309 (2005-01-01), McCann
patent: 6953999 (2005-10-01), Stranberg et al.
patent: 7045868 (2006-05-01), Ding et al.
patent: 7059048 (2006-06-01), Koning et al.
patent: 7203394 (2007-04-01), Wiegele et al.
patent: 7268436 (2007-09-01), Aigner et al.
patent: 2003/0155643 (2003-08-01), Freidhoff
patent: 2004/0063249 (2004-04-01), Lin et al.
patent: 2004/0077154 (2004-04-01), Nagarajan et al.
patent: 2004/0259325 (2004-12-01), Gan
patent: 2005/0054133 (2005-03-01), Felton et al.
patent: 2006/0126313 (2006-06-01), Steiner et al.
patent: 2006/0194361 (2006-08-01), Heck et al.
patent: 2006/0211233 (2006-09-01), Gan et al.
patent: 2007/0158787 (2007-07-01), Chanchani
patent: 2007/0274058 (2007-11-01), Cousin
patent: 2008/0003761 (2008-01-01), Gan et al.
patent: 2008/0064142 (2008-03-01), Gan et al.
patent: 2008/0217708 (2008-09-01), Reisner et al.
patent: 2004072071 (2004-03-01), None
K. C. Eun et al., “Fully Embedded LTCC Spiral Inductors Incorporating Air Cavity for High Q-factor and SRF,” IEEE Electronic Components and Technology Conference, vol. 1, Jun. 1-4, 2004, pp. 1101-1103.
M. Franosch, “Wafer-Level-Package for Bulk Acoustic Wave (BAW) Filters,” IEEE Microwaves Symposium, vol. 2, Jun. 6-11, 2004, pp. 493-496.
Young Chul Lee et al., “Monolithic LTCC SiP Transmitter for 60GHz Wireless Communication Terminals,” IEEE Microwaves Symposium, Jun. 17, 2005, pp. 1015-1018.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wafer level package including a device wafer integrated with... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer level package including a device wafer integrated with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer level package including a device wafer integrated with... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4127358

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.