LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Thermally-enhanced lead frame with reduced thermal gap

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Thermoplastic resin composition for semiconductor, adhesion...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Thin GaAs die with copper back-metal structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Thin radio frequency transponder with leadframe antenna structur

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Thin semiconductor integrated circuit device assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Thin semiconductor integrated circuit device assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Thin semiconductor package having many pins and likely to dissip

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Thin tin preplated semiconductor leadframes

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Thin type semiconductor device and module structure using the de

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Thin, high leadcount package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Thin, thermally enhanced flip chip in a leaded molded package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Three-level leadframe for no-lead packages

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Tie bar over chip lead frame design

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

TMOS-infrared uncooled sensor and focal plane array

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Transverse hybrid LOC package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Transverse hybrid LOC package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Transverse hybrid LOC package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Transverse hybrid LOC package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Trench substrate