Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2006-07-18
2010-11-30
Gulakowski, Randy (Department: 1796)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C564S464000, C528S026000, C528S028000, C528S038000, C528S350000, C528S340000, C528S342000, C528S353000, C528S347000, C528S348000, C257SE21002, C257SE21536, C257SE23037, C438S111000, C438S118000
Reexamination Certificate
active
07843045
ABSTRACT:
The object of the present invention is to provide an adhesion film for semiconductor that is capable of bonding a semiconductor chip to a lead frame tightly at an adhesion temperature lower than that of the adhesion film of a traditional polyimide resin without generation of voids and that can also be used for protection of lead frame-exposed area, a thermoplastic resin composition for semiconductor for use in the adhesive agent layer therein, and a lead frame having the adhesive film and a semiconductor device; and, to achieve the object, the present invention provides a thermoplastic resin composition for semiconductor, comprising a thermoplastic resin obtained in reaction of an amine component containing an aromatic diamine mixture (A) containing 1,3-bis(3-aminophenoxy)benzene, 3-(3′-(3″-aminophenoxy)phenyl)amino-1-(3′-(3″-aminophenoxy)phenoxy)benzene and 3,3′-bis(3″-aminophenoxy)diphenylether, and an acid component (C), an adhesion film for semiconductor using the same, a lead frame having the adhesion film and a semiconductor device using the same.
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Korean Official Action mailed Jul. 29, 2009, for Application No. 10-2008-7001316.
Kawai Toshiyasu
Nagoya Tomohiro
Tanabe Yoshiyuki
Tateoka Kiyohide
Tomoda Naoko
Antonelli, Terry Stout & Kraus, LLP.
Gulakowski Randy
Hitachi Chemical Co. Ltd.
Kahn Rachel
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