Three-level leadframe for no-lead packages

Details Three-level leadframe for no-lead packages Three-level leadframe for no-lead packages

2005-07-12

2005-07-12

Wilson, Allan R. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000, C257S692000, C257S696000

Reexamination Certificate

active

06917098

ABSTRACT:
A semiconductor device (700) having a leadframe with a first plurality of segments (110) having a narrow end portion (111) in a first horizontal plane (211) and a wide end portion (112) in a second horizontal plane (212). The leadframe further includes a second plurality of segments (120) having a narrow center portion (121) in the first horizontal plane, at least one wide center portion (122) in the second horizontal plane, and narrow end portions (123) in a third horizontal plane (213), which is located between the first and second planes.

REFERENCES:
patent: 2004/0212053 (2004-10-01), Koh et al.
patent: 2004/0217450 (2004-11-01), Li et al.
patent: 582084 (1994-06-01), None

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