Thermally-enhanced lead frame with reduced thermal gap

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

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Details

257676, 257698, 257669, H01L 23495, H01L 2334

Patent

active

059145285

ABSTRACT:
A lead frame structure includes a lead frame skeleton and at least one die bar connected between the lead frame skeleton and a non-quadrangular die attach paddle. Each of a plurality of leads has an outer edge connected to the lead frame skeleton and an inner edge disposed adjacent to but separated from the periphery of the die attach paddle. Preferably, the inner edge of each lead is separated from the periphery of the die attach paddle by about 5-10 mils.

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