Thin semiconductor package having many pins and likely to dissip

Details Thin semiconductor package having many pins and likely to dissip Thin semiconductor package having many pins and likely to dissip

1993-12-23

1995-08-15

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257676, 257713, H01L 23495, H01L 23498, H01L 2334

Patent

active

054422329

ABSTRACT:
The present invention provides a semiconductor device. In the device of the present invention, a metal lead wire is mounted to one surface of a carrier tape. One end of the metal lead wire is connected to a semiconductor chip. A lead frame is mounted to one surface of a reinforcing plate. The other end of the metal lead wire is connected to one end of an inner lead wire. The semiconductor chip is mounted to one surface of the reinforcing plate having an open portion positioned in the tip portion of the inner lead. Further, the semiconductor chip is covered with a resin layer.

REFERENCES:
patent: 4965660 (1990-10-01), Ogihara et al.
patent: 5227662 (1993-07-01), Ohno et al.

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