Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1997-02-07
1999-05-18
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257675, 257676, 257712, 257796, H01L23/495
Patent
active
059052996
ABSTRACT:
The present invention discloses a thermally enhanced Thin Quad Flatpack (TQFP) integrated circuit package. The invention's thermally enhanced TQFP is sufficiently thin for use in small form factor electronic systems such as Personal Computer Memory Card International Association (PCMCIA) Type III (10.5 millimeter) disk drives, modules and cards. Furthermore, the invention's thermally enhanced TQFP is reliable and has a significantly reduced thermal resistivity. Moreover, the invention does not require expensive tooling of the leadframe. Accordingly, the invention's thermally enhanced TQFP's production cost is far below that of comparable thermally enhanced packages. The invention's thermally enhanced TQFP comprises a leadframe having a number of leads. A heat spreader is attached to the bottom of the leadframe. The heat spreader extends to, and is in thermal contact with, the leads of the leadframe. This permits a larger surface for heat dissipation. The leadframe's die pad is attached to the top side of the heat spreader. A semiconductor die is attached to the top side of the die pad. The die is connected to the leads of the leadframe by means of bond wires. The entire unit is inside a plastic mold. According to the invention, to reduce the downset of the die pad, the semiconductor die is thinner than a standard die. This permits use of a die pad while permitting the heat spreader to be in direct contact with the leads of the leadframe.
REFERENCES:
patent: 5225710 (1993-07-01), Westerkamp
patent: 5402006 (1995-03-01), O'Donely
patent: 5493153 (1996-02-01), Arikawa et al.
Brady III W. James
Donaldson Richard R.
Potter Roy
Swayze, Jr. W. Daniel
Texas Instruments Inc.
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