Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1999-04-29
2000-11-21
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257676, H01L 23495
Patent
active
061507105
ABSTRACT:
A hybrid semiconductor package is formed from a die having two opposed elongate die edges with conductive bond pads arranged transversely relative to the rows of outer leads. A first portion of inner leads is off-die wire bonded to some of the bond pads, and a second portion of inner leads is insulatively attached as LOC leads between the bond pads along the opposed die edges. The hybrid package results in shorter inner leads of increased pitch enabling improved line yield at wire bond and encapsulation, as well as improved electrical performance, particularly for packages with very small dice.
REFERENCES:
patent: 4033844 (1977-07-01), Pantiga et al.
patent: 4089733 (1978-05-01), Zimmerman
patent: 4279682 (1981-07-01), Hamagami et al.
patent: 4801999 (1989-01-01), Hayward et al.
patent: 4835120 (1989-05-01), Mallik et al.
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4891687 (1990-01-01), Mallik et al.
patent: 4894752 (1990-01-01), Murata et al.
patent: 4937656 (1990-06-01), Kohara
patent: 4943843 (1990-07-01), Okinaga et al.
patent: 4984059 (1991-01-01), Kubota et al.
patent: 4989068 (1991-01-01), Yasuhara et al.
patent: 5140404 (1992-08-01), Fogal et al.
patent: 5142450 (1992-08-01), Olson et al.
patent: 5184208 (1993-02-01), Sakuta et al.
patent: 5218229 (1993-06-01), Farnworth
patent: 5227661 (1993-07-01), Heinen
patent: 5227662 (1993-07-01), Ohno et al.
patent: 5229639 (1993-07-01), Hansen et al.
patent: 5231755 (1993-08-01), Emanuel
patent: 5233220 (1993-08-01), Lamson et al.
patent: 5252853 (1993-10-01), Michii
patent: 5286679 (1994-02-01), Farnworth et al.
patent: 5304842 (1994-04-01), Farnworth et al.
patent: 5331200 (1994-07-01), Teo et al.
patent: 5331201 (1994-07-01), Nishino
patent: 5352633 (1994-10-01), Abbott
patent: 5418189 (1995-05-01), Heinen
patent: 5461255 (1995-10-01), Chan et al.
patent: 5466888 (1995-11-01), Beng et al.
patent: 5471369 (1995-11-01), Honda et al.
patent: 5475918 (1995-12-01), Kubota et al.
patent: 5521426 (1996-05-01), Russell
patent: 5592019 (1997-01-01), Ueda et al.
patent: 5883427 (1999-03-01), Arimoto
Louis T. Manzione, "Plastic Packaging of Microelectronic Devices", pps. 156-347, 1990.
Caroline A. Kovac, "Plastic Package Fabricaton", pps. 470-482.
Clark Sheila V.
Micro)n Technology, Inc.
LandOfFree
Transverse hybrid LOC package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Transverse hybrid LOC package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Transverse hybrid LOC package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1260054