Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2005-05-10
2005-05-10
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S666000, C257S673000, C257S707000, C257S787000, C257S784000
Reexamination Certificate
active
06891256
ABSTRACT:
Embodiments of the invention are directed to semiconductor die packages. One embodiment of the invention is directed to a semiconductor die package including, (a) a semiconductor die including a first surface and a second surface, (b) a source lead structure including protruding region having a major surface, the source lead structure being coupled to the first surface, (c) a gate lead structure being coupled to the first surface, and (d) a molding material around the source lead structure and the semiconductor die, where the molding material exposes the second surface of the semiconductor die and the major surface of the source lead structure.
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“Package Information,” Aug. 1998, pp. 1-5, Vishay Siliconix, Santa Clara, CA.
“Tape and Reel Information,” Aug. 1998, pp. 1-7, Vishay Siliconix, Santa Clara, CA.
Joshi Rajeev
Wu Chung-Lin
Fairchild Semiconductor Corporation
Mandala Jr. Victor A.
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