Thin semiconductor integrated circuit device assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

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257723, 257790, 257692, H01L 2331, H01L 2348, H01L 2500

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active

054481066

ABSTRACT:
A plurality of electrodes are formed on one surface of a semiconductor integrated circuit chip. A plurality of leads are arranged around the chip. Each of the electrodes and one end of each of the leads are connected. The electrodes and the chip are sandwiched between two films. One of the films is in direct contact with the one surface of the chip. The other film is in direct contact with the other surface of the chip.

REFERENCES:
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patent: 5099306 (1992-03-01), Dunaway et al.
patent: 5130783 (1992-07-01), McLellan
patent: 5160999 (1992-11-01), Opitz
patent: 5175612 (1992-12-01), Long et al.
Cover sheet for PCT International Application #WO90/05379 17 May 1990, Optiz et al.
Patent Abstracts of Japan, vol. 13, No. 509, (E-846), Nov. 15, 1989, abstract of Japanese Patent Application No. 1206651, Aug. 18, 1989.
Patent Abstracts of Japan, vol. 10, No. 179 (E-414), Jun. 24, 1986, abstract of Japanese Patent Application No. 61027663, Feb. 7, 1986.
U.S. patent applicatin Ser. No. 07/707,763 (Abandoned).

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