Thin type semiconductor device and module structure using the de

Details Thin type semiconductor device and module structure using the de Thin type semiconductor device and module structure using the de

1993-05-24

1995-08-29

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257686, 257702, 257787, H01L 2348

Patent

active

054463130

ABSTRACT:
Ends of inner leads are disposed in the vicinity of a peripheral end of a semiconductor chip and a portion of an insulating film tape is affixed to a main surface of the semiconductor chip by an adhesive while other portions of the insulating film tape are affixed to portions of the inner leads by an adhesive. Electrode pads provided in the main surface of the semiconductor chip are electrically connected to the ends of the corresponding inner leads by bonding wires, and the semiconductor chip, the inner leads, the electrode pads, the insulating film tape and the bonding wires are sealed by a resin molding. A thickness of the insulating film tape is smaller than a height from the main surface of the semiconductor chip to an apex of the bonding wire. Surfaces of the ends of the inner leads connected to the bonding wires are positioned to be lower than the main surface of the semiconductor chip and the inner leads are positioned between the main surface and an opposite surface of the semiconductor chip.

REFERENCES:
patent: 4649415 (1987-03-01), Hebert
patent: 4943843 (1990-07-01), Okinaga et al.
patent: 4996587 (1991-02-01), Hinrichsmeyer et al.
patent: 5018003 (1991-05-01), Yasunaga et al.
patent: 5055912 (1991-10-01), Murasawa et al.
patent: 5072280 (1991-12-01), Matsukura
patent: 5184208 (1993-02-01), Sakuta et al.
patent: 5245215 (1993-09-01), Sawaya
patent: 5252853 (1993-10-01), Michii
"DRAM TSOP", in Gain 83, Hitachi, Ltd., Nov., 1990, pp. 30-31 (Translation or concise explanation of relevant portions not currently available).
(Article relating to TSOPs/TABs), in Nikkei Microdevices, Feb., 1991, pp. 65-66 (Translation or concise explanation of relevant portions not currently available).

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