Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Patent
1996-03-25
1998-07-28
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With bumps on ends of lead fingers to connect to semiconductor
257666, 257674, 257735, 257737, 343873, 439916, H01L 23495, H01L 2348, H01L 2352, H01L 2940
Patent
active
057866260
ABSTRACT:
A novel radio frequency transponder (tag) with a minimum of components and connects is thin and flexible because these components and connects can be unsupported by a substrate layer. This is accomplished by using a conducting leadframe structure not only as a connection medium but also as a circuit element, i.e., the transponder antenna. In various preferred embodiments, the leadframe is mechanically positioned and fixably attached to a circuit chip so that the leadframe (antenna) is self supporting. A protective coating can be added where the leadframe is attached to the circuit chip. Further a protective surrounding can envelops the entire leadframe antenna, circuit chip, and, if provided, the protective coating.
REFERENCES:
patent: 5528222 (1996-06-01), Moskowitz et al.
Patent Abstracts of Japan, vol. 13, No. 560 (M-906) 13 Dec. 1989 & JP, A, 01 234 296 (NEC Corp.) 19 Sep. 1989.
Brady Michael J.
Favreau Normand Gilles
Guindon Francois
Moskowitz Paul Andrew
Murphy Philip
Arroyo Teresa M.
IBM Corporation
Percello Louis J.
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