Thin semiconductor integrated circuit device assembly

Details Thin semiconductor integrated circuit device assembly Thin semiconductor integrated circuit device assembly

1995-05-30

1997-09-30

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257691, 257692, 257790, H01L 2331, H01L 2348

Patent

active

056729081

ABSTRACT:
A plurality of electrodes are formed on one surface of a semiconductor integrated circuit chip. A plurality of leads are arranged around the chip. Each of the electrodes and one end of each of the leads are connected. The electrodes and the chip are sandwiched between two films. One of the films is in direct contact with the one surface of the chip. The other film is in direct contact with the other surface of the chip.

REFERENCES:
patent: 5130783 (1992-07-01), McLellan
patent: 5160999 (1992-11-01), Opitz
patent: 5448106 (1995-09-01), Fujitsu
Patent Abstracts of Japan, vol. 13, No. 509, (E-846), Nov. 15, 1989, abstract of Japanese Patent Application No. 1206651, Aug. 18, 1989.
Patent Abstracts of Japan, vol. 10, No. 179 (E-414), Jun. 24, 1986, abstract of Japanese Patent Application No. 61027663, Feb. 7, 1986.
U.S. Patent Application Serial No. 08/344,605.

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