Thin, high leadcount package

Details Thin, high leadcount package Thin, high leadcount package

1992-11-06

1994-10-25

Limanek, Robert

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

257787, H01L 2328

Patent

active

053592255

ABSTRACT:
A high leadcount surface mount IC package. The IC package of the present invention includes a plastic molded compound which is localized over the surface of the die, such that it covers the interconnections of the die. The package includes a leadframe having many leads. The leads are supported using a ring support structure.

REFERENCES:
patent: 4680617 (1987-07-01), Ross
patent: 4721994 (1988-01-01), Mine et al.
patent: 4796080 (1989-01-01), Phy
patent: 4891687 (1990-02-01), Mallik et al.
patent: 5184207 (1993-02-01), Cain

Affiliated with

Also associated with

Rating

Thin, high leadcount package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin, high leadcount package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin, high leadcount package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-137708