LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor chip

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor chip and semiconductor device including the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Semiconductor chip assembly with laterally aligned filler...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Semiconductor chip assembly with precision-formed metal pillar

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Semiconductor chip cooling apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor chip having a supporting member, tape...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Semiconductor chip having an underplate metal layer

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor chip mounting substrate and flat display

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Semiconductor chip package assembly with deflection-...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor chip package device having a rounded or chamfered

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor chip package having chip attach pad with perimeter

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Semiconductor chip package using flexible circuit board with...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Semiconductor chip package using improved tape mounting

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor chip with electrodes on side surface

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Semiconductor chip with external connecting terminal

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Semiconductor component and method of assembling the same