Semiconductor chip with electrodes on side surface

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

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Details

257737, 257786, 361764, 361769, 361774, 361776, H01L 23482, H01L 23495

Patent

active

056061986

ABSTRACT:
A semiconductor device comprising a semiconductor chip substrate, an integrated circuit formed on a surface of the semiconductor chip substrate, and metal electrodes extending from the integrated circuit to at least one of the side surfaces of the semiconductor chip substrate. Occupation area on a wiring circuit board can be reduced. Damaged chips can be exchanged easily. When it is set vertically, heat radiation efficiency can be improved.

REFERENCES:
patent: 4465898 (1984-08-01), Orcutt et al.
patent: 4495376 (1985-01-01), Hightower et al.
patent: 4622574 (1986-11-01), Garcia
patent: 4822988 (1989-04-01), Gloton
patent: 5126286 (1992-06-01), Chance
patent: 5266833 (1993-11-01), Capps
patent: 5341027 (1994-08-01), Park et al.

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