Semiconductor chip package

Details Semiconductor chip package Semiconductor chip package

2011-01-25

2011-01-25

Tran, Long K (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257S668000, C257SE23004, C257SE23031, C257SE23043, C257SE23046, C257SE23052, C438S123000, C438S380000

Reexamination Certificate

active

07875965

ABSTRACT:
A semiconductor chip package is disclosed. The semiconductor chip package comprises a lead frame having a chip carrier, wherein the chip carrier has a first surface and an opposite second surface. A semiconductor chip is mounted on the first surface, having a plurality of bonding pads thereon, wherein the semiconductor chip has an area larger than that of the chip carrier. A package substrate comprises a central region attached to the second surface, having an area larger than that of the semiconductor chip, wherein some of the bonding pads of the semiconductor chip are electrically connected to a marginal region of the package substrate.

REFERENCES:
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patent: 5508556 (1996-04-01), Lin
patent: 5789811 (1998-08-01), Chia et al.
patent: 5818105 (1998-10-01), Kouda
patent: 5920116 (1999-07-01), Umehara et al.
patent: 5933710 (1999-08-01), Chia et al.
patent: 2003/0214023 (2003-11-01), Uchida
patent: 2008/0303124 (2008-12-01), Khan et al.
patent: 1098557 (1995-02-01), None
patent: 2585407 (2003-11-01), None
patent: 0617464 (2002-05-01), None
patent: 61014731 (1986-02-01), None
patent: 4245466 (1992-09-01), None
patent: 7297348 (1995-11-01), None
patent: 2000058739 (2000-02-01), None
English abstract of CN1098557A, pub. Feb. 8, 1995.
English language translation of abstract of CN 2585407 (published Nov. 5, 2003).
European Search Report dated Sep. 14, 2010.
English language translation of abstract of JP 61014731 (published Jan. 22, 1986).
English language translation of abstract of JP 4245466 (published Sep. 2, 1992).
English language translation of abstract of JP 7297348 (published Nov. 10, 1995).
English language translation of abstract of JP 2000058739 (published Feb. 25, 2000).

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