Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent
1997-08-06
1998-12-08
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
257666, H01L 23495
Patent
active
058474463
ABSTRACT:
A semiconductor chip package comprises a chip attach pad having a slot formed in a perimeter region thereof. A chip having input/output pads thereon is bonded with the chip attach pad, and leads corresponding to the input/output pads are arranged around the chip. Each lead is electrically coupled to each input/output pad by a bonding wire. The chip, the chip attach pad, bonding wires, and leads are encapsulated by a molding compound. The slot of the chip attach pad corresponds to edges of the chip, so that the lower surface edges of the chip are located along the slot and are exposed through the slot. The molding compound is contained within the slot of the chip attach pad, and adheres to the lower surface edges of the chip. Accordingly, failures such as delaminations or cracks can be prevented. The slot may be divided into several discrete slots, and a tie-bar may be joined to the chip attach pad.
REFERENCES:
patent: 4952999 (1990-08-01), Robinson et al.
patent: 5708294 (1998-01-01), Toriyama
patent: 5712507 (1998-01-01), Eguchi et al.
Choi Jong Kon
Park Sang Young
Clark S. V.
Saadat Mahshid D.
Samsung Electronics Co,. Ltd.
LandOfFree
Semiconductor chip package having chip attach pad with perimeter does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor chip package having chip attach pad with perimeter, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor chip package having chip attach pad with perimeter will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-180795