Semiconductor chip cooling apparatus

Details Semiconductor chip cooling apparatus Semiconductor chip cooling apparatus

1991-06-03

1993-05-11

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

257714, 257719, 361385, 361388, H01L 2504, H01L 2348

Patent

active

052104400

ABSTRACT:
A novel semiconductor chip cooling apparatus includes at least one semiconductor die packaged according to a TAB design. A support structure supports the die, and a dike is connected to the support structure and the TAB tape to form a cavity impervious to liquid and air. Input and output means are connected to the cavity. Fluid means circulate throughout the cavity and utilize the input and output means to directly cool the die during operation of the semiconductor die. Heat spreading means may be positioned below the die to increase the amount of surface area which contacts the fluid means, thereby cooling the die more efficiently.

REFERENCES:
patent: 3365620 (1968-01-01), Butler et al.
patent: 3706010 (1972-12-01), Laermer et al.
patent: 4186422 (1980-01-01), Laermer
patent: 4547834 (1985-10-01), Dumont et al.
patent: 4748495 (1988-05-01), Kucharek
patent: 5031025 (1991-07-01), Braun et al.
patent: 5053853 (1991-10-01), Haj-Ali-Ahmadi et al.
patent: 5065279 (1991-11-01), Lazenby et al.

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