Semiconductor assembly with package using cup-shaped lead-frame

Details Semiconductor assembly with package using cup-shaped lead-frame Semiconductor assembly with package using cup-shaped lead-frame

2005-06-21

2005-06-21

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S678000, C257S728000, C257S730000, C257S782000

Reexamination Certificate

active

06909170

ABSTRACT:
A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the leadframe are bent in such a way that portions of the leads are coplanar with the other side of the die, which also contains one or more terminals. A plastic capsule is formed around the leadframe and die.

REFERENCES:
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patent: 5920117 (1999-07-01), Sono et al.
patent: 5977630 (1999-11-01), Woodworth et al.
patent: 5990500 (1999-11-01), Okazaki
patent: 6046501 (2000-04-01), Ishikawa et al.
patent: 406177429 (1994-06-01), None
patent: 406314822 (1994-11-01), None
patent: 406324077 (1994-11-01), None
patent: 408335720 (1996-12-01), None
patent: 409064421 (1997-03-01), None
patent: 411284117 (1999-10-01), None

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