Semiconductor chip package

Details Semiconductor chip package Semiconductor chip package

1995-05-08

1997-10-14

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257692, 257738, 257778, 257787, H01L 23495

Patent

active

056775660

ABSTRACT:
A semiconductor chip package that includes discrete conductive leads in electrical contact with bond pads on a semiconductor chip. This chip/lead assembly is encapsulated within an encapsulating material and electrode bumps are formed through the encapsulating material to contact the conductive leads. The electrode bumps protrude from the encapsulating material for connection to an external circuit.

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