Semiconductor chip

Details Semiconductor chip Semiconductor chip

1997-10-16

2000-05-30

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257501, 257723, 257725, H01L 23495

Patent

active

060694017

ABSTRACT:
A system and method for forming semiconductor devices on more than one surface of a chip is disclosed. A bed is formed with separate portions which connect to a first circuit on a first semiconductor face of a semiconductor chip. A second circuit resides on the opposite face of the semiconductor chip. Providing two circuits on separate faces of a semiconductor chip allows for savings of physical area of the chip. By providing a face-to-face contact with a first circuit, heat generated by the first circuit may be drawn away by the bed. Accordingly, smaller semiconductor chips may be realized without excessive heat generation.

REFERENCES:
patent: 3953254 (1976-04-01), Valdman
patent: 4888625 (1989-12-01), Mueller
patent: 5703405 (1997-12-01), Zeber
patent: 5739067 (1998-04-01), DeBusk et al.

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