Semiconductor component and method of assembling the same

Details Semiconductor component and method of assembling the same Semiconductor component and method of assembling the same

2007-09-25

2007-09-25

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S672000, C257S674000, C257S690000, C257S773000, C257S776000, C257SE23037, C257SE23040

Reexamination Certificate

active

11224301

ABSTRACT:
A semiconductor component includes at least one semiconductor power switch, wherein a gate electrode and at least two source regions are disposed on the upper side of the semiconductor power switch. The component further includes a leadframe including a die pad and a number of leads disposed on one side of the die pad. A number of connectors extends between the source regions and the source leads such that each source lead is electrically connected to each source region.

REFERENCES:
patent: 6534787 (2003-03-01), Sander et al.
patent: 7095099 (2006-08-01), Oliver et al.
patent: 2003/0136968 (2003-07-01), Fjelstad
patent: WO98/21751 (1998-05-01), None

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