Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2007-05-29
2007-05-29
Pham, Long (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S668000, C257S702000, C257S704000, C257S737000, C257S784000, C257S687000
Reexamination Certificate
active
10331918
ABSTRACT:
A semiconductor chip mounting substrate having a semiconductor bare chip and a substrate electrically connected to the semiconductor bare chip by wire bonding is provided. Here, a protective film is provided on the surface of the semiconductor bare chip and is disposed so as to expose all or a part of a bonding wire.
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Kawada Toyoshi
Sano Yuji
Fujitsu Hitachi Plasma Display Limited
Pham Long
Staas & Halsey , LLP
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