Semiconductor chip mounting substrate and flat display

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Details

C257S668000, C257S702000, C257S704000, C257S737000, C257S784000, C257S687000

Reexamination Certificate

active

10331918

ABSTRACT:
A semiconductor chip mounting substrate having a semiconductor bare chip and a substrate electrically connected to the semiconductor bare chip by wire bonding is provided. Here, a protective film is provided on the surface of the semiconductor bare chip and is disposed so as to expose all or a part of a bonding wire.

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