Semiconductor chip package

Details Semiconductor chip package Semiconductor chip package

2008-11-07

2010-11-16

Tran, Long K (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257S675000, C257S706000, C257S707000, C257SE23004, C257SE23031, C257SE23043, C257SE23046, C257SE23052, C438S123000, C438S380000

Reexamination Certificate

active

07834436

ABSTRACT:
An image processing system including an image processing device and a service providing device is provided. The image processing device includes a first processor and a first memory storing instructions that cause the image processing device to obtain parameters for receiving the service from the service providing device, request the service providing device to provide the service and implement a first or second function of the image processing device based on the parameters obtained from the parameter specifying unit. The service providing device includes a second processor and a second memory storing instructions that cause the service providing device to execute a service function to provide the service to the image processing device after receiving a request for the service from the image processing device.

REFERENCES:
patent: 5389816 (1995-02-01), Shimizu et al.
patent: 5789811 (1998-08-01), Chia et al.
patent: 5818105 (1998-10-01), Kouda
patent: 5920116 (1999-07-01), Umehara
patent: 5933710 (1999-08-01), Chia et al.
patent: 6724071 (2004-04-01), Combs
patent: 2005/0093118 (2005-05-01), Itou et al.
patent: 2008/0303124 (2008-12-01), Khan et al.
patent: 2585407 (2003-11-01), None
Cited in Office Action mailed Apr. 14, 2010 in U.S. Appl. No. 12/050,210.
English language translation of abstract of CN 2585407 (published Nov. 5, 2003).

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