Semiconductor chip assembly with laterally aligned filler...

Details Semiconductor chip assembly with laterally aligned filler... Semiconductor chip assembly with laterally aligned filler...

2006-11-27

2008-11-18

Ngo, Ngan (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With bumps on ends of lead fingers to connect to semiconductor

C257S674000, C257S692000, C257S696000, C257S698000, C257S737000, C257S738000, C257SE23011

Reexamination Certificate

active

07453140

ABSTRACT:
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a filler, a connection joint that electrically connects the routing line and the pad, an encapsulant and an insulative base. The routing line contacts the filler and extends laterally beyond the filler, and the filler contacts the insulative base in an aperture that extends through the insulative base.

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