Semiconductor chip package device having a rounded or chamfered

Details Semiconductor chip package device having a rounded or chamfered Semiconductor chip package device having a rounded or chamfered

1997-04-11

1998-09-22

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257669, 257676, H01L 23495

Patent

active

058118748

ABSTRACT:
A semiconductor chip packaging device includes a lead frame electrically connected to the chip and mechanically supporting the chip; a metal layer guard ring formed along at least one peripheral edge of an active surface of the chip; at least one slit formed at corner parts of the chip; a passivation layer covering the metal layer guard ring, the chip and the lead frame; and a package body made of a molding resin encapsulating the passivation layer, the lead frame, the metal layer and the chip; the metal layer guard ring being chamfered or rounded at corner parts of the chip to reduce shear stresses at the corner parts of the chip.

REFERENCES:
patent: 4625227 (1986-11-01), Hara et al.
patent: 4952999 (1990-08-01), Robinson et al.
patent: 5023699 (1991-06-01), Hara
patent: 5293064 (1994-03-01), Yoshimoto et al.
patent: 5338972 (1994-08-01), Mgoro

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