Packaged integrated circuit having gold removed from a lead...
Packaged integrated circuit providing trace access to...
Packaged integrated circuit with MLP leadframe and method of...
Packaged microelectronic devices and methods of forming same
Packaged microelectronic devices including first and second...
Packaged microelectronic devices with a lead frame
Packaged microelectronic devices with pressure release...
Packaged microelectronic elements with enhanced thermal conducti
Packaged semiconductor device
Packaged semiconductor device and a lead frame therefor, having
Packaged semiconductor device and a leadframe therefor
Packaged semiconductor device and method of manufacture...
Packaged semiconductor device having tab tape and particular pow
Packaged semiconductor device including multiple semiconductor c
Packaged semiconductor device utilizing leadframe attached on a
Packaging high power integrated circuit devices
Packaging of semiconductor chips with resin
Packaging of semiconductor circuit in pre-molded plastic package
Packaging substrate comprising staggered vias
Packaging system for field effects transistors