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Packaged integrated circuit having gold removed from a lead...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Packaged integrated circuit providing trace access to...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Packaged integrated circuit with MLP leadframe and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Packaged microelectronic devices and methods of forming same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Packaged microelectronic devices including first and second...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Packaged microelectronic devices with a lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...
Reexamination Certificate

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Packaged microelectronic devices with pressure release...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Packaged microelectronic elements with enhanced thermal conducti

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent

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Packaged semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Packaged semiconductor device and a lead frame therefor, having

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent

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Packaged semiconductor device and a leadframe therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Packaged semiconductor device and method of manufacture...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Packaged semiconductor device having tab tape and particular pow

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Packaged semiconductor device including multiple semiconductor c

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Packaged semiconductor device utilizing leadframe attached on a

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Packaging high power integrated circuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Packaging of semiconductor chips with resin

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Packaging of semiconductor circuit in pre-molded plastic package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Patent

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Packaging substrate comprising staggered vias

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Packaging system for field effects transistors

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Patent

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