Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2006-03-07
2006-03-07
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S676000, C257S690000, C257S692000, C257S698000, C257S728000
Reexamination Certificate
active
07009282
ABSTRACT:
A packaged integrated circuit for installation on a printed wiring board (PWB) or other type of circuit mounting structure, that allows for the routing of high-speed signals out from high-speed leads on an underside of the packaged integrated circuit. The packaged integrated circuit comprises a die and a package body formed from encapsulant that at least partially encloses the die. A leadframe is also connected to the die and partially enclosed in the package body. Leads extend out from the package body and a subset of these leads are separated by a lead-to-lead pitch. At least two adjacent leads of the leadframe are separated by a space larger than the pitch. An additional lead is also connected to the die and disposed on an underside of the package. The additional lead is connectable to a circuit mounting structure trace passing between the adjacent leads separated by the space larger than the pitch.
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Agere Systems Inc.
Parekh Nitin
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