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Leadframes for high adhesion semiconductor devices and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Leadframes for improved moisture reliability and enhanced...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Leadframes for improved moisture reliability of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Leadframes including offsets extending from a major plane...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Leadframes with selective palladium plating

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Leadless integrated circuit package having electrically...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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Leadless leadframe implemented in a leadframe-based BGA package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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Leadless leadframe package design that provides a greater...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Leadless leadframe package substitute and stack package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Leadless leadframe packaging panel featuring peripheral...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Leadless leadframe with an improved die pad for mold locking

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Leadless plastic chip carrier with etch back pad singulation

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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Leadless plastic chip carrier with etch back pad singulation

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Leadless semiconductor device and method for making the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Leadless semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

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Leadless semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Leadless semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

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Leadless semiconductor package and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Leadless semiconductor product packaging apparatus having a...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Leadless type semiconductor package, and production process...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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