Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2006-02-07
2006-02-07
Tran, Minh-Loan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S691000, C257S737000, C257S738000, C257S786000
Reexamination Certificate
active
06995460
ABSTRACT:
A leadless plastic chip carrier is constructed by half etching one or both sides of the package design onto a leadframe strip so as to create unique design features such as power and/or ground ring surrounding the die attach pad, interlocking rivet head construction for the contact pads, and an interlocking pattern for the die attach pad. After wire bonding and molding, a further etching is performed to isolate and expose contact pads. Singulation of individual chip packages from the leadframe strip is then performed by saw singulation or die punching.
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U.S. Appl. No. 10/697,339, Neil McLellan et al., “Process for Fabricating a Leadless Plastic Chip Carrier”, filed Oct. 30, 2003, currently pending.
U.S. Appl. No. 10/353,241, Neil McLellen et al., “Leadless Plastic Chip Carrier With Etch Back Pad Singulation”, filed Jan. 28, 2003, currently pending.
U.S. Appl. No. 10/757,499, Chun Ho Fan et al., Electronic Components Such as Thin Array Plastic Packages and Process for Fabricating Same, filed Jan. 15, 2004, currently pending.
U.S. Appl. No. 09/802,678, Neil McLellan et al., Leadless Plastic Chip Carrier With Etch Back Pad Singlulation, filed Mar. 9, 2001, currently pending.
Fan Chun Ho
Kwan Kin Pui
Lau Wing Him
McLellan Neil
Tsang Kwok Cheung
ASAT Ltd.
Keating & Bennett LLP
Tran Minh-Loan
LandOfFree
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